About Andrew: I am a recent graduate from California Polytechnic State University with the Master of Science degree in Electrical Engineering (2008). I also hold a Bachelor of Science degree in Computer Engineering (2006) from Cal Poly.
These works are posted to disseminate the information learned through each research project and are released for that purpose only; these documents may be digitally displayed, shared, and/or printed but original credit must not be removed. Before reuse of these materials for any other purpose send email to Andrew Farris <lordmorgul at gmail.com>.
Drop Impact Reliability and Lead-free Electronics
- paper (site): A. Farris, J. Pan, A. Liddicoat, Michael Krist, Nicholas Vickers, B. J. Toleno, D. Maslyk, D. Shangguan, J. Bath, D. Willie, D. A. Geiger, "Drop Impact Reliability of Edge-bonded Lead-free Chip Scale Packages", Microelectronics Reliability, Vol. 49, No. 7, 2009, pp. 761-770.
- paper (pdf): A. Farris, J. Pan, A. Liddicoat, B. J. Toleno, D. Maslyk, D. Shangguan, J. Bath, D. Willie, D. A. Geiger, “Drop Test Reliability of Lead-free Chip Scale Packages”, Proceedings of 2008 IEEE ECTC, pp. 1173-1180.
- presentation (ppt / pdf): Drop Test Reliability of Lead-free Chip Scale Packages, 2008 IEEE ECTC
- presentation (ppt / pdf): Drop Test Reliability of Lead-free Chip Scale Packages, SMTA Silicon Valley Chapter meeting, 19 June 2008
- presentation (ppt / pdf): Board Level Failure Analysis of Chip Scale Packages, SMTA Silicon Valley Chapter meeting, 19 June 2008, presented by Nicholas Vickers
- video (avi): A high-speed video showing a JEDEC JESD22-B111 standard drop impact test vehicle under 1500G-0.5ms input acceleration load, shot at 1000fps (courtesy Cal Poly and Henkel Corporation)
- software: DropGather, a windows console program written to control a high-speed data acquisition system for drop impact testing. This has been released as open source under the GPLv3. Documentation can be found within my thesis posted below.
Masters Thesis
- paper (pdf): Drop Impact Reliability Testing Lead-free Chip Scale Packages, June 2008; discusses development of a high-speed data acquisition system for drop impact testing handheld electronics.
A listing of the above files can be found in the /files/ directory.