Research and Publications

About: Andrew is a graduate from California Polytechnic State University with the Master of Science degree in Electrical Engineering (2008). He also has a Bachelor of Science degree in Computer Engineering (2006) from Cal Poly. He can be reached at lordmorgul gmail com.

Drop Impact Reliability and Lead-free Electronics

Published Papers

paper (pdf): A. Farris, J. Pan, A. Liddicoat, B. J. Toleno, D. Maslyk, D. Shangguan, J. Bath, D. Willie, D. A. Geiger, "Drop Test Reliability of Lead-free Chip Scale Packages", Proceedings of 2008 IEEE ECTC, pp. 1173-1180.
paper (pdf): M. Krist, J. Pan, A. Farris, N. Vickers, "Drop impact dynamic response study of JEDEC JESD22-B111 test board", Proceedings of the 41th International Symposium on Microelectronics (IMAPS-2008), Providence, RI, USA, Nov. 1 - 6, 2008.
paper (pdf): N. Vickers, K. Rauen, A. Farris, J. Pan, "Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies", Proceedings of the 41th International Symposium on Microelectronics (IMAPS-2008), Providence, RI, USA, Nov. 1 - 6, 2008.

Other Work

presentation (ppt / pdf): Drop Test Reliability of Lead-free Chip Scale Packages, 2008 IEEE ECTC
presentation (ppt / pdf): Drop Test Reliability of Lead-free Chip Scale Packages, SMTA Silicon Valley Chapter meeting, 19 June 2008
presentation (ppt / pdf): Board Level Failure Analysis of Chip Scale Packages, SMTA Silicon Valley Chapter meeting, 19 June 2008, presented by Nicholas Vickers
video (avi): A high-speed video showing a JEDEC JESD22-B111 standard drop impact test vehicle under 1500G-0.5ms input acceleration load, shot at 1000fps (courtesy Cal Poly and Henkel Corporation)
software: DropGather, a windows console program written to control a high-speed data acquisition system for drop impact testing. This has been released as open source under the GPLv3. Documentation can be found within my thesis posted below.

Masters Thesis

paper (pdf): Drop Impact Reliability Testing Lead-free Chip Scale Packages, June 2008; discusses development of a high-speed data acquisition system for drop impact testing handheld electronics.
presentation (ppt / pdf): Thesis defense, Drop Impact Reliability of Lead-free Chip Scale Packages, presented by Andrew Farris, May 2008.

A listing of the above files can be found in the /files/ directory.